| PART |
Description |
Maker |
| CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K
IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ
IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52
8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20
IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CI201210-6N8J CI201210-5N6D CI201210-4N7D CI201210 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| C1206C2745RAC C1206C6845RAC C1206C68415RAC C1206C3 |
Triple buffer with open-drain outputs, SOT505-2 (TSSOP8), Reel Pack, Reverse
3.3 V 16-bit buffer/driver; 3-state, SOT362-1 (TSSOP48), Tube
3.3 V 16-bit buffer/driver; 3-state, SOT1025-1 (HUQFN60U), Reel Dry Pack, 7" 表面贴装陶瓷电容扩展206，X7R介质500000伏特
Surface Mount Ceramic Chip Capacitors Extended Values 1206, X7R Dielectric, 25, 50, 100, 200 Volts 表面贴装陶瓷电容扩展206，X7R介质5500000伏特
Surface Mount Ceramic Chip Capacitors Extended Values 1206, X7R Dielectric, 25, 50, 100, 200 Volts 表面贴装陶瓷电容扩展206，X7R介质255000200伏特
|
KEMET Corporation
|
| AS8SLC128K32Q-55L_883C AS8SLC128K32Q-55L_IT AS8SLC |
128K x 32 SRAM SRAM MEMORY ARRAY
128K X 32 MULTI DEVICE SRAM MODULE, 12 ns, CPGA66 PGA-66
128K X 32 MULTI DEVICE SRAM MODULE, 12 ns, CQFP68 CERAMIC, QFP-68
|
Austin Semiconductor, Inc
Micross Components
|
| ROK104022 ROK104001 ROK104021 |
Bluetooth MULTI CHIP MODULE
|
Infineon Technologies A...
Infineon Technologies AG
|
| MC-7881 |
GaAs MULTI-CHIP MODULE
|
NEC
|
| TH50VSF4682AASB TH50VSF4683AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| CYM4208HD-40MB CYM4208HD-40C |
64K X 9 MULTI DEVICE FIFO MODULE, 40 ns, DMA28
64K X 9 OTHER FIFO, 40 ns, CDIP28 0.600 INCH, CERAMIC, MODULE, DIP-28
|
Cypress Semiconductor, Corp.
|
| HPC0402B4R3CWYW HPC0402B4R3BGYW HPC0402B4R3BWYW HP |
CAPACITOR, CERAMIC, 16 V, 0.0000043 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, 16 V, 0.0000047 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, 16 V, 0.0000012 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, 16 V, 0.0000013 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, 16 V, 0.0000062 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, 16 V, 0.000003 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, 16 V, 0.0000033 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, 16 V, 0.0000036 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, 16 V, 0.000002 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, 16 V, 0.0000068 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, 16 V, 0.000001 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
|
Vishay Intertechnology, Inc.
|
| AT68166FT-YM25-E AT68166FT-YM25-SCC AT68166FT-YS18 |
Rad Hard 16 MegaBit 3.3V 5V Tolerant SRAM Multi-Chip Module
|
ATMEL Corporation
|
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